Commonly considered for formed panels, covers and equipment housings requiring good formability and corrosion resistance.
- From prototype to production · Built for demanding engineering teams
── Data Centers & AI Infrastructure
BAOSONG manufactures aluminum thermal, chassis and structural components for AI servers, liquid-cooling equipment, edge-compute systems and the infrastructure that supports reliable deployment.
── Manufacturing for high-density compute
AI hardware increases the importance of heat transfer, contact flatness, coolant boundaries, rack fit, cable access, serviceability and repeatable assembly. A part must perform inside the complete compute and cooling system.
We coordinate extrusion, CNC machining, fabrication, surface finishing and defined assembly work around the thermal, structural and integration requirements of the equipment program.
── High-value aluminum product focus
Product families where thermal performance, complex profiles, machined interfaces and system-ready delivery create meaningful value beyond commodity aluminum supply.
AI SERVER & CHASSIS HARDWARE
GPU and accelerator server chassis components
Machined, fabricated or extruded members for rack-mount systems, compute trays and internal structures.
Server rails, card supports and mounting beams
Precision hardware that establishes board, accelerator, power and service interfaces.
Edge-compute and network enclosures
Compact aluminum housings with thermal features, connector openings, mounting details and finished exterior surfaces.
BATTERY PACK STRUCTURES
Cold-plate bodies and covers
Machined or extruded aluminum components with controlled flow features, ports, sealing lands and thermal interfaces.
CDU frames and equipment housings
Structural frames, panels, brackets and machined interfaces for coolant-distribution equipment.
Manifold supports and connection hardware
Mounting plates, clamps, brackets and structural components around fluid-distribution systems.
Immersion-cooling structural components
Tank frames, covers and equipment supports subject to project-specific material and fluid-compatibility review.
THERMAL MANAGEMENT
High-fin extruded heat sinks
Custom thermal profiles for server power, network, accelerator and control hardware.
Machined thermal bases and housings
Flat mounting interfaces, pockets, mounting patterns and integrated enclosure features.
UPS, inverter and power-module cooling parts
Heat sinks, thermal plates, structural covers and equipment housings for data-center power systems.
SOLAR & POWER HARDWARE
Rack, cabinet and rail components
Structural members, equipment supports, doors, panels and integration hardware manufactured to the rack architecture.
Cable-management trays and supports
Extruded or fabricated pathways for overhead, rack-level and underfloor cable organization.
Containment and cooling-equipment structures
Frames, partitions, fan supports and air-management components for data-center equipment areas.
Maintenance and monitoring hardware
Service frames, sensor brackets, equipment stands and structures for facility operations.
01
BATTERY SYSTEMS
Flow features, thermal interfaces, sealing lands, cover geometry, ports and inspection requirements planned together.
02
E-POWERTRAIN
Extrusion design, cut length, CNC features, flatness, surface condition and packaging matched to the thermal assembly.
03
CHARGING SYSTEMS
Lightweight members with dense mounting patterns, card support, cable access and repeatable rack interfaces.
04
CHARGING SYSTEMS
Structural frames, panels, doors, brackets and equipment interfaces coordinated for coolant-system integration.
05
CHARGING SYSTEMS
Compact thermal housings combining environmental protection, power dissipation and accessible field connections.
── AI infrastructure manufacturing
Thermal components, chassis interfaces and finished equipment structures presented in the context engineers and sourcing teams need to evaluate.
01 / AI SERVER OR COOLING SYSTEM
Integrated battery energy storage cabinets built for protection, thermal control and service access.
02 / LIQUID-COOLING COMPONENT
Cold-plate body, cover, manifold support or port interface
03 / THERMAL HARDWARE
Heat sink, fin profile, thermal base or power housing
04 / CHASSIS & RACK INTERFACE
Rail, bracket, enclosure, cable path or structural assembly
We identify the characteristics that can limit thermal contact, fluid integrity, assembly fit or field service, then plan manufacturing and inspection around those requirements.
Thermal-interface control
Define contact flatness, surface finish, mounting pattern and protected handling for heat-transfer surfaces.
Coolant-boundary planning
Review flow paths, ports, sealing lands, joining access, cleanliness and the specified pressure or leak-test plan.
Chassis and rack integration
Control rail spacing, mounting datums, card support, cable access and service features used by the final equipment.
── Data that improves the quote
Geometry alone is not enough for thermal and liquid-cooling hardware. These inputs help us evaluate material, process, inspection and assembly risk before tooling or production begins.
THERMAL
Heat source, interface area, allowable temperature rise, contact flatness and surface requirements.
FLUID
Coolant chemistry, operating and test pressure, flow target, sealing concept and cleanliness level.
MECHANICAL
Envelope, mounting datums, loads, rail interfaces, cable zones and service clearances.
QUALITY
Critical dimensions, leak-test method, traceability, sampling plan, quantities and required reports.
── Material and finish selection
The final alloy and surface route depend on conductivity, strength, extrusion geometry, machining, joining, coolant compatibility, electrical requirements and corrosion exposure.
6063 series
Often considered for heat-sink and complex profile applications where extrusion performance, thermal behavior and finish quality matter.
6061 series
Frequently selected for cold-plate bodies, structural bases, chassis components and parts with substantial CNC machining.
5052 series
Commonly considered for formed panels, covers and equipment housings requiring good formability and corrosion resistance.
Project-specific
Alternative alloys, coatings, conversion treatments, masking and material pairs require review against the actual system.
Surface-control note: Anodizing, conversion coating, powder coating and bare electrical-contact zones serve different functions. Define thermal contact, grounding, bonding, coolant exposure and cosmetic requirements before the finish is released.
AI INFRASTRUCTURE IN OPERATION
Thermal or structural component installed in its compute system
── Hardware in context
BAOSONG coordinates material, profile geometry, machined interfaces, finish and verification so the aluminum hardware arrives prepared for compute and cooling integration.
── Typical applications
01
Chassis members, thermal parts, card supports, rails and enclosure hardware.
02
Cold-plate components, frames, panels, manifold supports and connection hardware.
03
Compact enclosures, thermal housings, mounting structures and environmental hardware.
04
Heat sinks, equipment housings, cable supports, containment and cooling structures.
── FAQ
BAOSONG supports heat sinks, cold-plate bodies and covers, server chassis parts, rack and rail hardware, CDU frames and enclosures, power-equipment thermal components, cable-management structures and edge-compute housings.
We can manufacture cold-plate bodies, covers, ports and machined interfaces. Joining, cleanliness, pressure and leak-test requirements must be defined and qualified for the specific coolant and reliability plan before complete-assembly capability is confirmed.
The drawing should define the functional datum, flatness, surface finish, mounting pattern and any protected or masked areas. We plan machining, inspection and handling around those requirements.
Provide drawings or 3D models, alloy requirements, heat-load and interface data, coolant and pressure conditions, rack or chassis datums, finish, quantities, joining and leak-test specifications and documentation needs.
── Start your AI infrastructure project
Share the component model, heat-load and interface data, coolant and pressure conditions, critical datums, finish requirements, quantities and verification plan.
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